Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17584391
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Filing Dt:
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01/26/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Inventors:
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Chen-Lin Yeh, Jen-Hai Chi, Chih-Yung Hsieh
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Title:
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ELECTRONIC DEVICE WITH IMPROVED STRUCTURAL RELIABILITY INCLUDING ELECTRONIC COMPONENT AND DRIVING STRUCTURE COUPLED VIA CONDUCTOR LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 160 KESYUE RD., CHU-NAN SITE, HSINCHU SCIENCE PARK, CHU-NAN |
| MIAO-LI COUNTY, TAIWAN 35053 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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