Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17617399
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Filing Dt:
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12/08/2021
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Publication #:
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Pub Dt:
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08/18/2022
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Inventors:
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Jin Seong LEE, Young Chul KWON, Hyun Taek JEONG, Hyun Ji OH
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Title:
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Thermoplastic Resin Composition and Molded Article Formed Therefrom
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 300, OLYMPIC-RO SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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| ADDITON, PENDLETON & WITHERSPOON, P.A. |
| P.O. BOX 567 |
| MONROE, NC 28111 |
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06/18/2024 09:41 AM
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