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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17734683
Filing Dt:
05/02/2022
Publication #:
Pub Dt:
08/18/2022
Inventors:
Tz-Jun Kuo, Chien-Hsin HO, Ming-Han LEE
Title:
Interconnect Structure without Barrier Layer on Bottom Surface of Via
Assignment: 1
Reel/Frame:
059784/0339Recorded: 05/02/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/11/2017
Exec Dt:
08/11/2017
Exec Dt:
08/11/2017
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-77
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C.
1100 NEW YORK AVENUE NW
WASHINGTON, DC 20005

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