Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17734683
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Filing Dt:
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05/02/2022
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Publication #:
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Pub Dt:
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08/18/2022
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Inventors:
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Tz-Jun Kuo, Chien-Hsin HO, Ming-Han LEE
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Title:
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Interconnect Structure without Barrier Layer on Bottom Surface of Via
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVENUE NW |
| WASHINGTON, DC 20005 |
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06/27/2024 08:59 AM
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