Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17637899
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Filing Dt:
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02/24/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Inventors:
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Toshinori MIURA, Naoto KAMEDA, Mitsuru KEKURA
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Title:
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ATOMIC LAYER DEPOSITION DEVICE AND ATOMIC LAYER DEPOSITION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, OSAKI 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 141-6029 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET NW |
| WASHINGTON, DC 20007 |
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