Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17564124
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Filing Dt:
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12/28/2021
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Publication #:
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Pub Dt:
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08/25/2022
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Inventors:
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Yenheng Chen, Chengchung Lin
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Title:
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DOUBLE-LAYER PACKAGED 3D FAN-OUT PACKAGING STRUCTURE AND METHOD MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9 DONGSHENG WEST ROAD |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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| ALSTON & BIRD LLP |
| ONE SOUTH AT THE PLAZA, SUITE 4000 |
| 101 SOUTH TRYON STREET |
| CHARLOTTE, NC 28280-4000 |
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