Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17352371
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Filing Dt:
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06/21/2021
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Yung-Yu Lin, Chi-Yu Lai, Che-Wei Chang
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Title:
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POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN ADHESIVE LAYER, LAMINATE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.455, SINHE RD. LONGTAN, |
| TAOYUAN, TAIWAN 325 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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