Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17745127
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Filing Dt:
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05/16/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Chun-Yuan Chen, Shih-Chuan Chiu, Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin
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Title:
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Contact Resistance Between Via and Conductive Line
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAYNES AND BOONE, LLP |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAYNES AND BOONE, LLP (24061) IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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05/14/2024 10:24 PM
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