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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/11/2023
Application #:
17187682
Filing Dt:
02/26/2021
Publication #:
Pub Dt:
09/01/2022
Inventors:
Yan Xun Xue, Long-Ching Wang, Hongyong Xue, Madhur Bobde, Zhiqiang Niu, Jun Lu
Title:
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
Assignment: 1
Reel/Frame:
055437/0661Recorded: 02/26/2021Pages: 20
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/18/2021
Exec Dt:
02/26/2021
Exec Dt:
02/23/2021
Exec Dt:
02/26/2021
Exec Dt:
02/19/2021
Exec Dt:
02/23/2021
Assignee:
100 KING STREET WEST, SUITE # 6000
TORONTO, CANADA ONTARIO M5X 1E2
Correspondent:
CHEN-CHI LIN
1119 QUAIL CREEK CIR
SAN JOSE, CA 95120-4148

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