Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17192573
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Filing Dt:
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03/04/2021
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Publication #:
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Pub Dt:
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09/08/2022
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Inventors:
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HSI-WEN TIEN, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih-Wei Lu, Chung-Ju Lee
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Title:
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THE NOVEL DOUBLE PATTERNING APPROACH BY DIRECT METAL ETCH
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30077 |
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| FOLEY & LARDNER |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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