Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2023
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Application #:
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17189528
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Filing Dt:
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03/02/2021
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Publication #:
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Pub Dt:
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09/08/2022
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Inventors:
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Junli Wang, Albert Chu, Dechao Guo, Brent Anderson
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Title:
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INTERCONNECTS ON MULTIPLE SIDES OF A SEMICONDUCTOR STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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RYAN, MASON & LEWIS, LLP |
48 SOUTH SERVICE ROAD |
SUITE 100 |
MELVILLE, NY 11747 |
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09/23/2024 02:18 PM
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