Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17687350
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Filing Dt:
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03/04/2022
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Publication #:
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Pub Dt:
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09/08/2022
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Inventors:
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Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen et al
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Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300 |
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| ROBERT JENSEN |
| WOLF, GREENFIELD & SACKS, P.C. |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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