Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17683917
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Filing Dt:
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03/01/2022
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Publication #:
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Pub Dt:
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09/08/2022
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Inventors:
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Tsang-Yu LIU, Chaung-Lin LAI, Shu-Ming CHANG
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Title:
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CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
JHONGLI DIST. |
TAOYUAN CITY, TAIWAN 32062 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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09/23/2024 05:11 PM
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