Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17317906
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Filing Dt:
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05/12/2021
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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MAOHUA REN, Dian Han Liu, Yuan-Chi Pai, WEN YI TAN
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Title:
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METHOD FOR ALIGNING TO A PATTERN ON A WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.899 WAN JIA CHUN ROAD, XIAMEN XIANG'AN |
| XIAMEN, FUJIAN, CHINA |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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