Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17639471
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Filing Dt:
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03/01/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Sota KAMO, Kiyoka TAKAGI, Naoki MORI, Naoki MATSUDA
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Title:
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BONDING LAYER EVALUATION SYSTEM AND BONDING LAYER EVALUATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8332 |
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| 36-1, YOSHIDA-HONMACHI, SAKYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 606-8501 |
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| 8, NISHINOKYO-HIGASHI-TOGANO-CHO, NAKAGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 604-8520 |
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| BENJAMIN J. HAUPTMAN |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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