Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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07/09/2024
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Application #:
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17463556
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Filing Dt:
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09/01/2021
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Publication #:
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Pub Dt:
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09/22/2022
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Inventors:
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Feng-Chien Hsieh, Ting-Hao Chang, Chun-Hao Lin, Yun-Wei Cheng, Kuo-Cheng Lee
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Title:
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MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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KILPATRICK TOWNSEND & STOCKTON LLP |
1100 PEACHTREE STREET |
SUITE 2800 |
ATLANTA, GA 30309 |
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06/20/2024 02:25 PM
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