Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17214909
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Filing Dt:
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03/28/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Min-Horng LIU, Tze-Yang YEH, Kuo-Wei LEE
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Title:
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HEAT DISSIPATION SUBSTRATE FOR INCREASING SOLDERABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F., NO. 455, SEC. 2, WENHUA 3RD RD., |
| LINKOU DIST., |
| NEW TAIPEI CITY, TAIWAN 244 |
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| 6F., NO.51, HOUSHENG RD., LUZHU DIST., |
| TAOYUAN CITY, TAIWAN 338 |
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| LI & CAI INTELLECTUAL PROPERTY OFFICE |
| 9F, NO. 69, SEC. 2 DUNHUA S. RD |
| DA''AN DISTRICT |
| TAIPEI, 11106 TAIWAN |
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