Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/25/2023
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Application #:
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17372930
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Filing Dt:
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07/12/2021
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Hung-Te Lin, Hung-Chih Yu, Chia-Wei Liu
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Title:
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METHOD OF MANUFACTURING AT LEAST ONE SEMICONDUCTOR DEVICE ON OR IN A BASE SEMICONDUCTOR MATERIAL DISPOSED IN A CONTAINMENT STRUCTURE INCLUDING A BURIED LAYER
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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FAY SHARPE LLP |
1228 EUCLID AVENUE, 5TH FLOOR |
THE HALLE BUILDING |
CLEVELAND, OH 44115 |
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09/21/2024 02:57 PM
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