Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17838307
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Filing Dt:
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06/13/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
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Title:
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METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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HUAN-YI LIN |
4521 WELLFLEET DR |
HUNTINGTON BEACH, CA 92649 |
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09/25/2024 01:50 PM
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