Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17842810
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Filing Dt:
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06/17/2022
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Publication #:
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Pub Dt:
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10/06/2022
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Inventors:
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Chiung C. Lo, Wen-Chien Chen, Jemm Yue Liang, Martin George Lim et al
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Title:
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DEVICE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3255 KIFER ROAD |
| SANTA CLARA, CALIFORNIA 95051 |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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