Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17423150
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Filing Dt:
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07/15/2021
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Publication #:
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Pub Dt:
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10/06/2022
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Inventors:
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Chen Liu, Yuming Zhang, Hongliang LV
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Title:
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Package Structure for Semiconductor Device and Preparation Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2 SOUTH TAIBAI ROAD |
| XI'AN, CHINA 710071 |
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| MCDONNELL BOEHENEN HULBERT & BERGHOFF LLP |
| 300 S. WACKER DR |
| SUITE 3100 |
| CHICAGO, IL 60606 |
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