Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17641620
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Filing Dt:
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03/09/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Inventor:
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Jeong-Hwan LEE
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Title:
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INDIRECT BONDING DEVICE AND INDIRECT BONDING METHOD FOR ORTHODONTIC APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, MAGOKJUNGANG 12-RO, GANGSEO-GU |
| SEOUL, KOREA, REPUBLIC OF 07789 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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