Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17844366
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Filing Dt:
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06/20/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Inventors:
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Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Zuoguo Wu, Gerald Pasdast et al
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Title:
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STANDARD INTERFACES FOR DIE TO DIE (D2D) INTERCONNECT STACKS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| MARK J. ROZMAN |
| PO BOX 41790 |
| HOUSTON, TX 77241-1790 |
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06/08/2024 01:46 AM
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