Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17853502
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Filing Dt:
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06/29/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Inventors:
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Swadesh Choudhary, Lakshmipriya Seshan, Zuoguo Wu, Debendra Das Sharma, Narasimha Lanka et al
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Title:
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DIE-TO-DIE INTERCONNECT PROTOCOL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ALLIANCE IP, LLC |
| 20 E. THOMAS ROAD SUITE 2200 |
| PHOENIX, AZ 85012 |
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06/07/2024 03:28 AM
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