Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17393381
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Filing Dt:
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08/03/2021
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Publication #:
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Pub Dt:
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10/13/2022
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Inventor:
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Chung-Liang Cheng
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Title:
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High Density 3 Dimensional Gate All Around Memory
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| 1100 PEACHTREE STREET |
| NE SUITE 2800 |
| ATLANTA, GA 30309 |
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