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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17753998
Filing Dt:
03/21/2022
Publication #:
20220332978
Pub Dt:
10/20/2022
Inventors:
KEH-YEUAN LI, MING SHIH TSAI, XIAOBO SHI, RUNG-JE YANG, CHEN YUAN HUANG, LAURA M. MATZ
Title:
Low Dishing Copper Chemical Mechanical Planarization
Assignment: 1
Reel/Frame:
062638/0278Recorded: 02/09/2023Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LI, KEH-YEUAN
Exec Dt:
09/02/2022
TSAI, MING-SHIH
Exec Dt:
02/01/2023
SH, XIAOBO
Exec Dt:
07/19/2022
YANG, RUNG-JE
Exec Dt:
02/03/2023
HUANG, CHEN YUAN
Exec Dt:
02/06/2023
MATZ, LAURA M.
Exec Dt:
08/02/2022
Assignee:
VERSUM MATERIALS US, LLC
8555 SOUTH RIVER PARKWAY
PATENT DEPT.
TEMPE, ARIZONA 85284
Correspondent:
LISA HOFFMANN
7350 TILGHMAN STREET, SUITE 104
PATENT DEPT.
ALLENTOWN, PA 18106-9000

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