Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17853803
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Filing Dt:
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06/29/2022
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Publication #:
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Pub Dt:
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10/20/2022
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Inventors:
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Feng-Chien Hsieh, Yun-Wei Cheng, Mu-Han Cheng, Kuo-Cheng Lee, Hsin-Chi Chen
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Title:
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EDGE-TRIMMING METHODS FOR WAFER BONDING AND DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
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| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, VA 20191 |
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