Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17762859
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Filing Dt:
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03/23/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Kevin QUINQUINET, Susumu KUWABARA, Philippe GASTALDO
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Title:
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METHOD FOR MEASURING FILM THICKNESS DISTRIBUTION OF WAFER WITH THIN FILMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| 611 RUE ARISTIDE BERGÈS |
| Z.A. DE PRÉ MILLET |
| MONTBONNOT-SAINT-MARTIN, FRANCE 38330 |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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05/22/2024 01:09 AM
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