Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17326488
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Filing Dt:
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05/21/2021
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Wichai Kovitsophon, Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup et al
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Title:
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METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH SOLDER ENHANCED LEADFRAME TERMINALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2355 WEST CHANDLER BLVD. |
CHANDLER, ARIZONA 85224-6199 |
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SLAYDEN GRUBERT BEARD PLLC |
401 CONGRESS AVENUE |
SUITE 1650 |
AUSTIN, TX 78701 |
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09/22/2024 09:47 AM
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