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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17464980
Filing Dt:
09/02/2021
Publication #:
Pub Dt:
10/27/2022
Inventors:
Chung-Hao Cai, Chia-Hsien Yao, Chen-Ming Lee, Fu-Kai Yang, Mei-Yun Wang
Title:
Semiconductor Structures With Densly Spaced Contact Features
Assignment: 1
Reel/Frame:
057370/0743Recorded: 09/02/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/29/2021
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Exec Dt:
06/30/2021
Exec Dt:
06/28/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219
Assignment: 2
Reel/Frame:
058297/0498Recorded: 10/19/2021Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 057370 FRAME: 0743. ASSIGNOR(S) HEREBY CONFIRMS THE ASSINGMENT.
Assignors:
Exec Dt:
06/29/2021
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Exec Dt:
06/30/2021
Exec Dt:
06/28/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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