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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17763566
Filing Dt:
03/24/2022
Publication #:
20220346431
Pub Dt:
11/03/2022
Inventors:
Keigo HANYU, Tetsu KAMIYA, Koji YAMAMURA, Jin OGIWARA
Title:
SOLID FOOD, COMPRESSION-MOLDED FOOD POWDER PRODUCT, SOLID MILK, AND COMPRESSION-MOLDED POWDERED MILK PRODUCT HAVING REDUCED FRACTURE STRESS
Assignment: 1
Reel/Frame:
059394/0472Recorded: 03/24/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HAN, KEIGO
Exec Dt:
02/24/2022
KAMIYA, TETSU
Exec Dt:
09/30/2021
YAMAMURA, KOJI
Exec Dt:
02/15/2022
OGIWARA, JIN
Exec Dt:
02/18/2022
Assignee:
MEIJI CO., LTD.
2-1, KYOBASHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 1048306
Correspondent:
WENDEROTH, LIND & PONACK, LLP
1025 CONNECTICUT AVENUE NW
SUITE 500
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
060528/0786Recorded: 06/16/2022Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR KEIGO HANYU'S NAME IS MISSPELLED PREVIOUSLY RECORDED ON REEL 059394 FRAME 0472. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
HANYU, KEIGO
Exec Dt:
02/24/2022
KAMIYA, TETSU
Exec Dt:
09/30/2021
YAMAMURA, KOJI
Exec Dt:
02/15/2022
OGIWARA, JIN
Exec Dt:
02/18/2022
Assignee:
MEIJI CO., LTD.
2-1, KYOBASHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 1048306
Correspondent:
WENDEROTH, LIND & PONACK, LLP
1025 CONNECTICUT AVENUE NW
SUITE 500
WASHINGTON, DC 20036

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