Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2023
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Application #:
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17308347
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Filing Dt:
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05/05/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Kuo-Lung HOU, Ming-Hsien LIN
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Title:
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PLATING SYSTEM AND METHOD OF PLATING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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COOPER LEGAL GROUP LLC |
6505 ROCKSIDE ROAD SUITE 330 |
INDEPENDENCE, OH 44131 |
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