Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17315588
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Filing Dt:
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05/10/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Brandon P. Wirz, Liang Chun Chen
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Title:
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ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS AND SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP - MICRON PATENT-SEA |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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