Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17869860
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Filing Dt:
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07/21/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen
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Title:
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FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| ESCHWEILER & POTASHNIK |
| 629 EUCLID AVENUE |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
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