Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17874875
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Filing Dt:
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07/27/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Inventors:
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Brian COBB, Richard PRICE, Neil DAVIES
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Title:
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INTEGRATED CIRCUIT ON FLEXIBLE SUBSTRATE MANUFACTURING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NATIONAL CENTRE FOR PRINTABLE ELECTRONICS |
| THOMAS WRIGHT WAY, NETPARK |
| SEDGEFIELD DURHAM, UNITED KINGDOM TS21 3FG |
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| JASON H. VICK / SHERIDAN ROSS PC |
| 1560 BROADWAY |
| SUITE 1200 |
| DENVER, CO 80202 |
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06/16/2024 12:25 AM
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