Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17666933
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Filing Dt:
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02/08/2022
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Publication #:
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Pub Dt:
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11/17/2022
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Inventors:
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Hong-Ta Kuo, Yen Hao Huang, I-Shi Wang, Ming-Yi Shen, Tzu-Ping Yang, Hsing-Yu Wang et al
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Title:
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METHODS AND SYSTEMS FOR IMPROVING FUSION BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| RICHARD M. KLEIN |
| 1228 EUCLID AVENUE, 5TH FLOOR |
| CLEVELAND, OH 44115 |
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