Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17781804
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Filing Dt:
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06/02/2022
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Publication #:
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Pub Dt:
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11/24/2022
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Inventors:
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Yuji Shimizu, Rina Hoshika
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Title:
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Resin Composition, and Molded Article and Multilayer Structure Each Comprising Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1621, SAKAZU, KURASHIKI-SHI |
| OKAYAMA, JAPAN 710-0801 |
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| JANICE H. LOGAN |
| 1111 PENNSYLVANIA AVE NW |
| WASHINGTON, DC 20004 |
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09/21/2024 04:59 PM
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