Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17259938
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Filing Dt:
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01/13/2021
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Publication #:
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Pub Dt:
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11/24/2022
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Inventors:
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Jingyu SHEN, Qiyue ZHAO, Chunhua ZHOU, Chao YANG, Weigang YAO, Baoli WEI
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Title:
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Semiconductor Package and Method for Manufacturing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1066 LU SHEN AVE, FOHO HIGH-TECH ZONE, LILI TOWN, WUJIANG DISTRICT, SUZHOU, JIANGSU |
SUZHOU, CHINA |
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IDEA INTELLECTUAL LIMITED |
12F-1, NO.49. BO AI ROAD, |
ZHONGZHENG DISTRICT |
TAIPEI, 10044 TAIWAN |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SIXTH CONVEYING PARTY NAME PREVIOUSLY RECORDED AT REEL: 054912 FRAME: 0371. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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1066 LU SHEN AVE, FOHO HIGH-TECH ZONE, LILI TOWN, WUJIANG DISTRICT, SUZHOU, JIANGSU |
SUZHOU, CHINA |
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IDEA INTELLECTUAL LIMITED |
12F-1, NO.49, BO AI ROAD |
ZHONGZHENG DISTRICT |
TAIPEI CITY, 10044 TAIWAN |
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09/24/2024 12:48 PM
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