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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11961867
Issue Dt:
04/16/2024
Application #:
17837702
Filing Dt:
06/10/2022
Publication #:
20220375985
Pub Dt:
11/24/2022
Inventors:
Jin Young Kim, Yoon Joo Kim, Se Woong Cha, Ju Hoon Yoon, No Sun Park, Seung Jae Lee et al
Title:
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
061793/0833Recorded: 10/12/2022Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, JIN YOUNG
Exec Dt:
11/11/2013
PARK, NO SUN
Exec Dt:
11/12/2013
KIM, YOON JOO
Exec Dt:
11/12/2013
LEE, SEUNG JAE
Exec Dt:
11/13/2013
CHA, SE WOONG
Exec Dt:
11/10/2013
KIM, SUNG KYU
Exec Dt:
11/13/2013
YOON, JO HOON
Exec Dt:
11/12/2013
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON STREET
SUITE 3400
CHICAGO, 60661 UNITED STATES
Assignment: 2
Reel/Frame:
061390/0852Recorded: 10/12/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMKOR TECHNOLOGY, INC.
Exec Dt:
11/19/2019
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD
VALLEY POINT #12/03
SINGAPORE, SINGAPORE 248373
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON STREET
SUITE 3400
CHICAGO, IL 60661

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