Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17533234
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Filing Dt:
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11/23/2021
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Publication #:
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Pub Dt:
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12/01/2022
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Inventor:
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Wei-Hua Lu
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Title:
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HEAT ASSISTED FLIP CHIP BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, SHUEFU ROAD, NEIPU TOWNSHIP |
PINGTUNG COUNTY, TAIWAN |
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JACKSON INTELLECTUAL PROPERTY GROUP PLLC |
106 STARVALE LANE |
SHIPMAN, VA 22971 |
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09/23/2024 01:09 PM
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