Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17445786
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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12/01/2022
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Inventors:
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Hao HUANG, Huanlin ZHU, Wei SHI, Siu Kwan CHEUNG, Lijun ZHU
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Title:
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PACKAGING SUBSTRATE WITH LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1001 RIDDER PARK DRIVE |
| SAN JOSE, CALIFORNIA 95131 |
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| HARRITY & HARRITY, LLP |
| 11350 RANDOM HILLS ROAD |
| SUITE 600 |
| FAIRFAX, VA 22030 |
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