Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17755736
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Filing Dt:
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05/06/2022
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Publication #:
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Pub Dt:
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12/08/2022
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Inventors:
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Hyeon Jae YU, Andrey SALOV, Chi Hun LEE, Kyong Ho PARK, Seung Chul LEE
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Title:
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ARTIFICIAL INTELLIGENCE-BASED INJECTION MOLDING SYSTEM, AND METHOD FOR CREATING MOLDING CONDITIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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127, LS-RO, DONGAN-GU |
ANYANG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 14119 |
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K&L GATES LLP |
PO BOX 1135 |
CHICAGO, IL 60690 |
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09/22/2024 03:52 PM
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