Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17339830
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Filing Dt:
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06/04/2021
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Publication #:
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Pub Dt:
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12/08/2022
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Inventors:
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Li-Sheng WENG, Charles David PAYNTER, Ryan LANE, Jianwen XU, William STONE
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Title:
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PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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LOZA & LOZA LLP |
305 NORTH SECOND AVE., #127 |
UPLAND, CA 91786-6064 |
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09/27/2024 07:06 PM
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