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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/09/2024
Application #:
17354327
Filing Dt:
06/22/2021
Publication #:
Pub Dt:
12/22/2022
Inventors:
Syed Zeeshan Ali, Cerdin Ching Ching Lee, Ethan Gardner, Jonathan Owen Hardie et al
Title:
THERMAL FLUID SENSOR WITH ENCAPSULATED FLUID REGION
Assignment: 1
Reel/Frame:
060338/0593Recorded: 06/28/2022Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2021
Exec Dt:
06/17/2021
Exec Dt:
06/17/2021
Exec Dt:
06/17/2021
Exec Dt:
06/17/2021
Exec Dt:
06/17/2021
Assignee:
160 COWLEY ROAD
DEANLAND HOUSE
CAMBRIDGE, UNITED KINGDOM CB40DL
Correspondent:
CRAIG W. HAYDEN
1300 EAST 9TH STREET
SUITE 1700
CLEVELAND, OH 44114

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