Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17891184
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Filing Dt:
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08/19/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Inventors:
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Pao-Hung Chou, Shih-Ping Hsu, Chun-Hsien Yu, Tung-Yao Kuo
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Title:
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METHOD OF FABRICATING A FLIP-CHIP PACKAGE CORE SUBSTRATE WITH BUILD-UP LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 458-17, XINXING RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 303 |
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AMIN, TUROCY & WATSON, LLP |
200 PARK AVENUE |
SUITE 300 |
BEACHWOOD, OH 44122 |
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06/24/2024 04:56 AM
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