Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17844586
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Filing Dt:
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06/20/2022
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Publication #:
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Pub Dt:
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12/29/2022
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Inventors:
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J. Scott PERKINS, Ethan ESCOWITZ, Erick DAVIDSON, Riley REESE
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Title:
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MODULAR THERMOPLASTIC COMPOSITE STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 710 BANCROFT WAY |
| BERKELEY, CALIFORNIA 94710 |
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| KAPLAN BREYER SCHWARZ LLP |
| 90 MATAWAN ROAD, SUITE 201 |
| MATAWAN, NJ 07747 |
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09/26/2024 02:46 PM
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