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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17778191
Filing Dt:
05/19/2022
Publication #:
Pub Dt:
12/29/2022
Inventors:
Na SAI, Hideharu HIGASHINE
Title:
LAMINATED MOLDED BODY AND METHOD FOR MANUFACTURING SAME
Assignment: 1
Reel/Frame:
059959/0546Recorded: 05/19/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/09/2022
Exec Dt:
05/09/2022
Assignee:
57-1, SANSHA, YAMAGATA-SHI
YAMAGATA, JAPAN 990-0898
Correspondent:
STUDEBAKER & BRACKETT PC
8255 GREENSBORO DRIVE
SUITE 300
TYSONS, VA 22102

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