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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17358361
Filing Dt:
06/25/2021
Publication #:
20220415743
Pub Dt:
12/29/2022
Inventors:
Feras Eid, Adel Elsherbini, Johanna Swan, Shawna Liff, Aleksandar Aleksov, Julien Sebot
Title:
THERMAL PERFORMANCE IN HYBRID BONDED 3D DIE STACKS
Assignment: 1
Reel/Frame:
057443/0831Recorded: 09/10/2021Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
EID, FERAS
Exec Dt:
09/07/2021
ELSHERBINI, ADEL
Exec Dt:
08/18/2021
SWAN, JOHANNA
Exec Dt:
09/09/2021
LIFF, SHAWNA
Exec Dt:
09/09/2021
ALEKSOV, ALEKSANDAR
Exec Dt:
08/24/2021
SEBOT, JULIEN
Exec Dt:
08/25/2021
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
GREEN, HOWARD, & MUGHAL LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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