Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17901849
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Filing Dt:
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09/01/2022
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Publication #:
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Pub Dt:
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01/05/2023
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Inventors:
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Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin, Wen-Sung Hsu
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Title:
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SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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WOLF GREENFIELD & SACKS P.C. |
600 ATLANTIC AVENUE |
BOSTON, MA 02210 |
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09/22/2024 01:46 PM
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