Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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17371139
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Filing Dt:
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07/09/2021
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Publication #:
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Pub Dt:
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01/12/2023
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Inventors:
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Jingjing JING, Ning CHEN, Yinghong CHEN, Shaohong SHI
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Title:
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METHOD FOR FABRICATION OF 3D PRINTED PART WITH HIGH THROUGH-PLANE THERMAL CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.24 SOUTH SECTION 1, YIHUAN ROAD, CHENGDU |
CHENGDU, CHINA 610065 |
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GOKALP BAYRAMOGLU |
1540 WEST WARM SPRINGS RD., SUITE 100 |
SUITE 100 |
HENDERSON, NV 89014 |
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