Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17728048
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Filing Dt:
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04/25/2022
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Publication #:
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Pub Dt:
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01/12/2023
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Inventors:
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Harry-Hak-Lay Chuang, Hsin Fu Lin, Shiang-Hung Huang, Tsung-Hao Yeh
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Title:
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INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK, LLC |
| 629 EUCLID AVE. |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
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05/30/2024 06:03 PM
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